AEARU Advanced Materials Science Workshop <Deadline: 2017/07/20>
Published: June 12, 2017
Osaka University will host the AEARU* Advanced Materials Science Workshop 2017 for students from AEARU member universities. Invited professors from top-tier Asian universities will discuss the recent progress of material science. The workshop will focus on the state-of-the-art research topics in advanced smart materials & processing such as nanocomposites, ultralight & high-strength metals, biomaterials, 3D printing process and materials informatics. There will be a company tour for understanding the manufacturing and a city tour for a cultural learning experience in Osaka. For more details, please refer to Call for Applications.
* AEARU (Association of East Asian Research Universities) is comprised of 18 leading research-oriented universities in East Asia. Member universities include Tokyo Tech, the University of Tokyo, Osaka University, Tohoku University, the University of Tsukuba, Tsinghua University, Peking University, Hong Kong University of Science and Technology, Taiwan University, Seoul National University, KAIST, and others.
Application Outline
Dates |
Wednesday, November 1 – Thursday, November 2, 2017
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Venue |
Convention Center, Osaka University (Osaka, Japan)
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Eligibility |
Tokyo Tech undergraduate and graduate students
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Application documents |
① AEARU WS_2017_ApplicationForm (Form 1) *Incomplete documents will not be accepted. |
Deadline |
Thursday, July 20, 2017 at 17:00 |
Fees |
No fees are required. Accommodation expenses (three nights) and meals during the program will be provided for Tokyo Tech’s two nominees. Participants are responsible for travel and other expenditures.
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Application Submission & Inquiries |
International Cooperation Division, International Affairs Department
(South Building 6, 3F Room 301B) (Mail box: S6-6) For Inquiry: Email: kokuren.aearu@jim.titech.ac.jp (Send with the title “ AEARU Materials WS”) Tel:03-5734-3016 |
Contact:
International Cooperation Division, Tokyo Tech
Email: kokuren.aearu@jim.titech.ac.jp