The 36th Special Seminar of School of Engineering

The semiconductor industry is experiencing a tremendous upsurge with the spread and development of AI, smart phones, self-driving cars, robotics, and other technologies. Semiconductor devices have been miniaturized in two dimensions in accordance with Moores Law in order to meet the trend toward more compact devices, but two-dimensional miniaturization has already reached its limits and three-dimensional miniaturization is now underway. A prime example of this is NAND flash memory. NAND flash memory has already been commercialized in 3D, with production of 3D-NAND with more than 300 layers imminent, and research and development are underway aiming for over 1000 layers. The most advanced technology in creating three-dimensional semiconductor devices is film deposition technology. DRAM is already seriously considering 3D integration, and Logic is also already developing towards 3D integration. In this presentation, the latest various deposition technologies for 3D structured semiconductor devices will be introduced. In addition, the speaker will introduce his know-how for an enjoyable life as an engineer through his life experience as an engineer.

Wednesday, December 20, 2023, 4:45 p.m. - 5:45 p.m.
6:00 p.m. - Opinion Exchange Meeting (Student Welcome!!) Tubame Terrace, 2nd floor, West Bldg.5, Ookayama Area

Digital Multi-purpose Hall, West Bldg. 9 and Zoom

Unryu Ogawa
Executive Vice President, CTO KOKUSAI ELECTRIC CORPORATION

Japanese

School of Engineering

Integrated Green-niX

• Please register online from below. Deadline: Friday, December 8, 2023
  • Registration (Japanese)